Li, Er-Ping,
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li. - 1 PDF (224 pages).
Includes index.
Includes bibliographical references and index.
Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.
Restricted to subscribers or individual electronic text purchasers.
Mode of access: World Wide Web
9781118166727
9786613650047
Three-dimensional integrated circuits.
Electronic books.
TK7874.893 / .E7 2012eb
621.3815
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li. - 1 PDF (224 pages).
Includes index.
Includes bibliographical references and index.
Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.
Restricted to subscribers or individual electronic text purchasers.
Mode of access: World Wide Web
9781118166727
9786613650047
Three-dimensional integrated circuits.
Electronic books.
TK7874.893 / .E7 2012eb
621.3815