Saha, Sujoy Kumar.
Heat Transfer and Pressure Drop in Flow Boiling in Microchannels [electronic resource] / by Sujoy Kumar Saha, Gian Piero Celata. - 1st ed. 2016. - X, 55 p. 40 illus., 16 illus. in color. online resource. - SpringerBriefs in Thermal Engineering and Applied Science, 2193-2549 . - SpringerBriefs in Thermal Engineering and Applied Science, .
1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research.
This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Micro channels,” by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.
9783319202853
10.1007/978-3-319-20285-3 doi
Thermodynamics.
Heat engineering.
Heat transfer.
Mass transfer.
Fluid mechanics.
Continuum mechanics.
Engineering Thermodynamics, Heat and Mass Transfer.
Engineering Fluid Dynamics.
Continuum Mechanics.
TJ265 TP156.M3
621.4021
Heat Transfer and Pressure Drop in Flow Boiling in Microchannels [electronic resource] / by Sujoy Kumar Saha, Gian Piero Celata. - 1st ed. 2016. - X, 55 p. 40 illus., 16 illus. in color. online resource. - SpringerBriefs in Thermal Engineering and Applied Science, 2193-2549 . - SpringerBriefs in Thermal Engineering and Applied Science, .
1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research.
This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Micro channels,” by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.
9783319202853
10.1007/978-3-319-20285-3 doi
Thermodynamics.
Heat engineering.
Heat transfer.
Mass transfer.
Fluid mechanics.
Continuum mechanics.
Engineering Thermodynamics, Heat and Mass Transfer.
Engineering Fluid Dynamics.
Continuum Mechanics.
TJ265 TP156.M3
621.4021