Arbitrary Modeling of TSVs for 3D Integrated Circuits (Record no. 58608)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03299nam a22005295i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-3-319-07611-9 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20200421112547.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 140821s2015 gw | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9783319076119 |
| -- | 978-3-319-07611-9 |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.3815 |
| 100 1# - AUTHOR NAME | |
| Author | Salah, Khaled. |
| 245 10 - TITLE STATEMENT | |
| Title | Arbitrary Modeling of TSVs for 3D Integrated Circuits |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | IX, 179 p. 159 illus., 99 illus. in color. |
| 490 1# - SERIES STATEMENT | |
| Series statement | Analog Circuits and Signal Processing, |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Introduction: Work around Moore's Law -- 3D/TSV Enabling Technologies -- TSV Modeling and Analysis -- TSV Verification -- TSV Macro-Modeling Framework -- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter -- Imperfection in TSV Modeling -- New Trends in TSV -- TSV Fabrication -- Conclusions. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects.  Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis, and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor,  and inductive-based communication system, and bandpass filtering. �Introduces a robust model that captures accurately all the loss modes of a TSV,  coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region; �Enables readers to use a model which is technology dependent and can be used for any TSV configuration; �Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors; �Equips readers for fast parasitic extraction of TSVs for 3D IC design. |
| 700 1# - AUTHOR 2 | |
| Author 2 | Ismail, Yehea. |
| 700 1# - AUTHOR 2 | |
| Author 2 | El-Rouby, Alaa. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://dx.doi.org/10.1007/978-3-319-07611-9 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | Cham : |
| -- | Springer International Publishing : |
| -- | Imprint: Springer, |
| -- | 2015. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microprocessors. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Microelectronics. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronic circuits. |
| 650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Circuits and Systems. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Electronics and Microelectronics, Instrumentation. |
| 650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Processor Architectures. |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| -- | 1872-082X |
| 912 ## - | |
| -- | ZDB-2-ENG |
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