Electrical modeling and design for 3D system integration : (Record no. 59822)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03094nam a2200829 i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 6183551 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20200421114417.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 151221s2012 nju ob 001 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781118166727 |
| -- | ebook |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | electronic |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | hardback |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| -- | |
| 082 04 - CLASSIFICATION NUMBER | |
| Call Number | 621.3815 |
| 100 1# - AUTHOR NAME | |
| Author | Li, Er-Ping, |
| 245 10 - TITLE STATEMENT | |
| Title | Electrical modeling and design for 3D system integration : |
| Sub Title | 3D integrated circuits and packaging, signal integrity, power integrity and EMC / |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | 1 PDF (224 pages). |
| 500 ## - GENERAL NOTE | |
| Remark 1 | Includes index. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Remark 2 | Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. |
| 856 42 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
| 264 #1 - | |
| -- | [United States] : |
| -- | IEEE Press ; |
| -- | Hoboken [New Jersey] : |
| -- | Wiley, |
| 264 #2 - | |
| -- | [Piscataqay, New Jersey] : |
| -- | IEEE Xplore, |
| -- | [2012] |
| 336 ## - | |
| -- | text |
| -- | rdacontent |
| 337 ## - | |
| -- | electronic |
| -- | isbdmedia |
| 338 ## - | |
| -- | online resource |
| -- | rdacarrier |
| 588 ## - | |
| -- | Description based on PDF viewed 12/21/2015. |
| 650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
| -- | Three-dimensional integrated circuits. |
| 695 ## - | |
| -- | Admittance |
| 695 ## - | |
| -- | Copper |
| 695 ## - | |
| -- | Electromagnetic compatibility |
| 695 ## - | |
| -- | Electromagnetics |
| 695 ## - | |
| -- | Equations |
| 695 ## - | |
| -- | Equivalent circuits |
| 695 ## - | |
| -- | Etching |
| 695 ## - | |
| -- | Fabrication |
| 695 ## - | |
| -- | Frequency domain analysis |
| 695 ## - | |
| -- | Function approximation |
| 695 ## - | |
| -- | Impedance |
| 695 ## - | |
| -- | Indexes |
| 695 ## - | |
| -- | Integral equations |
| 695 ## - | |
| -- | Integrated circuit interconnections |
| 695 ## - | |
| -- | Integrated circuit modeling |
| 695 ## - | |
| -- | Mathematical model |
| 695 ## - | |
| -- | Microwave circuits |
| 695 ## - | |
| -- | Packaging |
| 695 ## - | |
| -- | Power transmission lines |
| 695 ## - | |
| -- | Printed circuits |
| 695 ## - | |
| -- | Scattering |
| 695 ## - | |
| -- | Silicon |
| 695 ## - | |
| -- | Simulation |
| 695 ## - | |
| -- | Solid modeling |
| 695 ## - | |
| -- | System-on-a-chip |
| 695 ## - | |
| -- | Three dimensional displays |
| 695 ## - | |
| -- | Through-silicon vias |
| 695 ## - | |
| -- | Transmission line matrix methods |
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