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Accelerated stress testing handbook : (Record no. 73954)

000 -LEADER
fixed length control field 07905nam a2201537 i 4500
001 - CONTROL NUMBER
control field 5270476
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20220712205705.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 100317t20152001nyua ob 001 0 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9780470544051
-- electronic
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
-- print
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
-- electronic
082 04 - CLASSIFICATION NUMBER
Call Number 620/.00452
082 04 - CLASSIFICATION NUMBER
Call Number 658.5/7
245 00 - TITLE STATEMENT
Title Accelerated stress testing handbook :
Sub Title guide for achieving quality products /
300 ## - PHYSICAL DESCRIPTION
Number of Pages 1 PDF (xxii, 372 pages) :
505 0# - FORMATTED CONTENTS NOTE
Remark 2 Foreword (F. Ianna). Preface. Acknowledgments. OVERVIEW. Introduction (H. Chan and P. Englert). Principles of Stress Testing (H. Chan and P. Englert). PROCESS AND GUIDELINES. Stress Testing Program: Generic Processes (H. Chan and P. Englert). Stress Testing Program Subprocesses (H. Chan and P. Englert). Guidelines for Design and Manufacturing Stress Testing (H. Chan and P. Englert). THEORY. Economic and Optimization (H. Chan and P. Englert). Reliability Growth (C. Seusy). Overview of the Failure Analysis Process for Electrical Components (G. Pfeiffer). EQUIPMENT AND TECHNIQUES. Accelerated Stress Testing Equipment and Techniques (C. Felkins). Vibration and Shock Inputs Identify Some Failure Modes (W. Tustin). Relative Effectiveness of Thermal Cycling Versus Burn-In (K. Lo and F. LoVasco). Accelerated Qualification of Electronic Assemblies Under Combined Temperature Cycling and Vibration Environments: Is Miner's Hypothesis Valid (K. Upadhyayula and A. Dasgupta)? Liquid Environmental Stress Testing (LEST) (P. Englert). Safety Qualification of Stress Testing (S. Rajaram). BEST PRACTICES CASE STUDIES IN COMPUTER, COMMUNICATIONS, AND OTHER INDUSTRIES. Production Ast with Computers Using the Taguchi Method (D. Pachuki). Design Ast with Vendor Electronics (C. Schinner). Design and Production Ast with Power Supplies (D. Dalland). Design and Production Ast with Computers (E. Kyser). Qualifications and Production Sampling Ast with Printed Circuit Boards (H. McLean). Manufacturing Ast with Telecommunication Products (T. Parker and G. Harrison). Production Ast with Computer Disks. Benchmarking (H. Malec). Glossary of Stress Testing Terminology. Bibliography. Index. Epilogue. About the Editors.
520 ## - SUMMARY, ETC.
Summary, etc As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST). The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame. Important topics covered include: . Theoretical basis for AST. General AST best practices. AST design and manufacturing processes. AST equipment and techniques. AST process safety qualification In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
Subject Electronic apparatus and appliances
General subdivision Testing.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
Subject Electronic apparatus and appliances
General subdivision Reliability.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
Subject Environmental testing.
700 1# - AUTHOR 2
Author 2 Chan, H. Anthony,
700 1# - AUTHOR 2
Author 2 Englert, Paul J,
856 42 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5270476
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type eBooks
264 #1 -
-- New York :
-- IEEE Press,
-- c2001.
264 #2 -
-- [Piscataqay, New Jersey] :
-- IEEE Xplore,
-- [2009]
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-- text
-- rdacontent
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-- electronic
-- isbdmedia
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-- online resource
-- rdacarrier
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-- Description based on PDF viewed 12/21/2015.
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-- Acceleration
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-- Approximation methods
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-- Assembly
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-- Availability
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-- Barium
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-- Benchmark testing
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-- Bibliographies
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-- Biographies
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-- Books
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-- Business
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-- Central Processing Unit
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-- Companies
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-- Computer aided software engineering
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-- Computers
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-- Containers
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-- Cooling
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-- Databases
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-- Degradation
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-- Economics
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-- Electric shock
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-- Electronics industry
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-- Equations
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-- Failure analysis
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-- Fatigue
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-- Fixtures
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-- Guidelines
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-- Indexes
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-- Industries
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-- Integrated circuit interconnections
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-- Internet
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-- Lead
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-- Life estimation
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-- Liquids
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-- Load modeling
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-- Manufacturing
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-- Manufacturing processes
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-- Materials
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-- Mathematical model
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-- Monitoring
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-- Nitrogen
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-- Optical fibers
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-- Optimization
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-- Pediatrics
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-- Portfolios
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-- Power supplies
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-- Power system reliability
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-- Principal component analysis
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-- Probability distribution
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-- Product development
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-- Production
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-- Production facilities
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-- Prototypes
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-- Qualifications
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-- Random access memory
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-- Reliability
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-- Reliability engineering
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-- Reliability theory
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-- Resonant frequency
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-- Robustness
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-- Safety
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-- Scanning electron microscopy
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-- Schedules
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-- Sections
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-- Sensors
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-- Software
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-- Soldering
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-- Springs
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-- Stress
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-- Stress measurement
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-- Surface treatment
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-- Temperature control
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-- Temperature distribution
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-- Temperature measurement
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-- Temperature sensors
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-- Terminology
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-- Test equipment
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-- Testing
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-- Thermal analysis
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-- Thermal loading
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-- Thermal stresses
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-- Throughput
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-- Transient analysis
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-- Vibration measurement
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-- Vibrations

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