Systems-Level Packaging for Millimeter-Wave Transceivers (Record no. 76521)

000 -LEADER
fixed length control field 03791nam a22005655i 4500
001 - CONTROL NUMBER
control field 978-3-030-14690-0
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20220801214606.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 190326s2019 sz | s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9783030146900
-- 978-3-030-14690-0
082 04 - CLASSIFICATION NUMBER
Call Number 621.384
100 1# - AUTHOR NAME
Author Božanić, Mladen.
245 10 - TITLE STATEMENT
Title Systems-Level Packaging for Millimeter-Wave Transceivers
250 ## - EDITION STATEMENT
Edition statement 1st ed. 2019.
300 ## - PHYSICAL DESCRIPTION
Number of Pages XV, 277 p.
490 1# - SERIES STATEMENT
Series statement Smart Sensors, Measurement and Instrumentation,
505 0# - FORMATTED CONTENTS NOTE
Remark 2 Introduction and Research Impact -- Millimeter-Wave Research Challenges.-Behavior of Active and Passive Devices at Millimeter-Wave Frequencies -- Integrated Substrates: Millimeter-Wave Transistor Technologies -- Discrete Substrates: Package Foundation -- Traditional Approach: System-on-Chip -- Multi-Chip Modules and Multi-Chip Packaging -- State-of-the-Art Approach: System-on-Package -- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.
520 ## - SUMMARY, ETC.
Summary, etc This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
700 1# - AUTHOR 2
Author 2 Sinha, Saurabh.
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier https://doi.org/10.1007/978-3-030-14690-0
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type eBooks
100 1# - AUTHOR NAME
-- (orcid)0000-0001-9174-0781
-- https://orcid.org/0000-0001-9174-0781
264 #1 -
-- Cham :
-- Springer International Publishing :
-- Imprint: Springer,
-- 2019.
336 ## -
-- text
-- txt
-- rdacontent
337 ## -
-- computer
-- c
-- rdamedia
338 ## -
-- online resource
-- cr
-- rdacarrier
347 ## -
-- text file
-- PDF
-- rda
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Wireless communication systems.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Mobile communication systems.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Engineering design.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Cooperating objects (Computer systems).
650 14 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Wireless and Mobile Communication.
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Engineering Design.
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Cyber-Physical Systems.
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE
-- 2194-8410 ;
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-- ZDB-2-ENG
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-- ZDB-2-SXE

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