Carbon Nanotubes for Interconnects (Record no. 79960)
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fixed length control field | 03960nam a22005295i 4500 |
001 - CONTROL NUMBER | |
control field | 978-3-319-29746-0 |
005 - DATE AND TIME OF LATEST TRANSACTION | |
control field | 20220801221715.0 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 160709s2017 sz | s |||| 0|eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
ISBN | 9783319297460 |
-- | 978-3-319-29746-0 |
082 04 - CLASSIFICATION NUMBER | |
Call Number | 621.3815 |
245 10 - TITLE STATEMENT | |
Title | Carbon Nanotubes for Interconnects |
Sub Title | Process, Design and Applications / |
250 ## - EDITION STATEMENT | |
Edition statement | 1st ed. 2017. |
300 ## - PHYSICAL DESCRIPTION | |
Number of Pages | XII, 333 p. 167 illus., 133 illus. in color. |
505 0# - FORMATTED CONTENTS NOTE | |
Remark 2 | Interconnect challenges for 2D and 3D Integration -- Overview of Carbon Nanotube Physical Properties -- Overview of Carbon Nanotube Processing Methods -- Electrical Conductivity of Carbon Nanotubes – Modeling and Characterization -- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material -- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects -- Carbon Nanotubes as Vertical Interconnects for 3D ICs -- Carbon Nanotubes as Micro-Bumps for 3D Integration -- Electrothermal Modeling of Carbon Nanotubes TSVs -- Exploring Carbon Nanotubes for 3D Power Delivery Networks -- Carbon Nanotubes for Monolithic 3D ICs. |
520 ## - SUMMARY, ETC. | |
Summary, etc | This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects. |
700 1# - AUTHOR 2 | |
Author 2 | Todri-Sanial, Aida. |
700 1# - AUTHOR 2 | |
Author 2 | Dijon, Jean. |
700 1# - AUTHOR 2 | |
Author 2 | Maffucci, Antonio. |
856 40 - ELECTRONIC LOCATION AND ACCESS | |
Uniform Resource Identifier | https://doi.org/10.1007/978-3-319-29746-0 |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Koha item type | eBooks |
264 #1 - | |
-- | Cham : |
-- | Springer International Publishing : |
-- | Imprint: Springer, |
-- | 2017. |
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-- | computer |
-- | c |
-- | rdamedia |
338 ## - | |
-- | online resource |
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347 ## - | |
-- | text file |
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-- | rda |
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Electronic circuits. |
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Microprocessors. |
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Computer architecture. |
650 14 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Electronic Circuits and Systems. |
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1 | |
-- | Processor Architectures. |
912 ## - | |
-- | ZDB-2-ENG |
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-- | ZDB-2-SXE |
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