Central Library

Normal view MARC view ISBD view

Electrical Design of Through Silicon Via [electronic resource] / edited by Manho Lee, Jun So Pak, Joungho Kim.

Contributor(s): Lee, Manho [editor.] | Pak, Jun So [editor.] | Kim, Joungho [editor.] | SpringerLink (Online service).
Material type: materialTypeLabelBookPublisher: Dordrecht : Springer Netherlands : Imprint: Springer, 2014Description: IX, 280 p. 249 illus. online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9789401790383.Subject(s): Engineering | Special purpose computers | Electronic circuits | Engineering | Circuits and Systems | Electronic Circuits and Devices | Special Purpose and Application-Based SystemsAdditional physical formats: Printed edition:: No titleDDC classification: 621.3815 Online resources: Click here to access online
Contents:
Preface -- 1 Introduction -- 2 Electrical Modeling of a Through-Silicon Via (TSV) -- 3 High-speed TSV-based Channel Modeling and Design -- 4 Noise Coupling and Shielding in 3D ICs -- 5 Thermal Effects on TSV Signal Integrity -- 6 Power Distribution Network (PDN) Modeling and Analysis for TSV and Interposer-based 3D-ICs in the Frequency Domain -- 7 TSV Decoupling Schemes -- Index.
In: Springer eBooksSummary: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity, and even thermal integrity. Most of the analysis in this book include simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have been studied deep into a TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
    average rating: 0.0 (0 votes)
No physical items for this record

Preface -- 1 Introduction -- 2 Electrical Modeling of a Through-Silicon Via (TSV) -- 3 High-speed TSV-based Channel Modeling and Design -- 4 Noise Coupling and Shielding in 3D ICs -- 5 Thermal Effects on TSV Signal Integrity -- 6 Power Distribution Network (PDN) Modeling and Analysis for TSV and Interposer-based 3D-ICs in the Frequency Domain -- 7 TSV Decoupling Schemes -- Index.

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity, and even thermal integrity. Most of the analysis in this book include simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have been studied deep into a TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

There are no comments for this item.

Log in to your account to post a comment.