Through silicon vias : materials, models, design, and performance / Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam.
By: Kaushik, Brajesh Kumar [author.]
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Contributor(s): Alam, Arsalan [author.] | Kumar, Vobulapuram Ramesh [author.] | Majumder, Manoj Kumar [author.].
Material type: 
BookPublisher: Boca Raton : CRC Press, [2017]Copyright date: ©2017Description: 1 online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9781315368825; 9781315332758.Subject(s): Three-dimensional integrated circuits | Interconnects (Integrated circuit technology)Additional physical formats: Print version: : No titleDDC classification: 621.395 Online resources: Click here to view.
Contents:
1. Three-dimensional technology and packaging techniques -- 2. Through silicon vias : materials, properties, and fabrication -- 3. Copper-based through silicon vias -- 4. Modeling and performance analysis of CNT-based through silicon vias -- 5. Mixed CNT bundled through silicon vias -- 6. Graphene nanoribbon-based through silicon vias -- 7. Liners in through silicon vias -- 8. Modeling of through silicon vias using finite-difference time-domain technique.
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1. Three-dimensional technology and packaging techniques -- 2. Through silicon vias : materials, properties, and fabrication -- 3. Copper-based through silicon vias -- 4. Modeling and performance analysis of CNT-based through silicon vias -- 5. Mixed CNT bundled through silicon vias -- 6. Graphene nanoribbon-based through silicon vias -- 7. Liners in through silicon vias -- 8. Modeling of through silicon vias using finite-difference time-domain technique.
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