Cover -- Half Title -- Title -- Copyright -- ABOUT THE AUTHOR -- CONTENTS -- LIST OF ABBREVIATIONS -- PREFACE -- ACKNOWLEDGMENTS -- INTRODUCTION -- PART I Custom Formulating -- CHAPTER 1. Materials and Process Engineering -- CHAPTER 2. The Art and Science of Formulating -- PART II Thermal Transfer Adhesives for Space Electronics -- CHAPTER 3. Thermal Transfer, Filleting Adhesives -- CHAPTER 4. Flexible Epoxy Thermal Transfer Adhesives for Flatpacks -- CHAPTER 5. More about the New Thermal Transfer Adhesives -- CHAPTER 6. Superior Thermal Transfer Adhesive -- PART III Other Custom-Formulated Compounds for Aerospace Electronics Applications -- CHAPTER 7. Radiopaque Adhesive/Sealant -- CHAPTER 8. Low Exotherm, Low-Temperature Curing, Epoxy Impregnants -- CHAPTER 9. Platable Adhesives for Cyanate Ester Composites -- CHAPTER 10. Reworkable, Thermally Conductive, Adhesives for Electronic Assemblies -- CHAPTER 11. Room Temperature-Stable, One-Component, Flexible Epoxy Adhesives -- PART IV Custom-Formulated Compounds for Automotive Electronics Applications -- CHAPTER 12. Air Bag Sensor Encapsulation -- CHAPTER 13. Reactive Hot Melt Conformal Coating Materials -- CHAPTER 14. Solder Joint Lead Encapsulation -- PART V Custom-Formulated Organic Solder to Eliminate Lead -- CHAPTER 15. Formulation of a Drop-Resistant, Organic Solder -- PART VI Rigid Polyurethanes for Aircraft Transparencies -- CHAPTER 16. Sierraclad Bird-Proof Canopies and Windshields -- PART VII Three Niche Technologies -- CHAPTER 17. Flexipoxy Technology -- CHAPTER 18. Hacthane Technology -- CHAPTER 19. Transparent Polyurethane Plastics -- PART VIIISpin-Off Applications -- CHAPTER 20. Spin-Off from Our Thermal Transfer Adhesives Patents -- CHAPTER 21. Spin-Off from Our Electrically Conductive Adhesives Patents -- CHAPTER 22. Spin-Off from Our Encapsulants, Potting Compounds, and Impregnants Patents -- CHAPTER 23. Spin-Off from Our High-Volume Electronic Assembly Materials Patents -- CHAPTER 24. Spin-Off from Our Specialty Adhesives Patents -- CHAPTER 25. Spin-Off from Our Specialty Rigid Thermosets Patents -- Appendix I -- Index.

Engineering design teams sometimes have need of a material that may not exist because the combination of required properties is difficult to achieve. One solution is to develop a new material having the required set of properties needed in the application. During the author's 40-year career he has successfully worked on many such problems. The uniquely useful and valuable book, Polymeric Thermosetting Compounds: Innovative Aspects of Their Formulation Technology, presents twenty of those design problems and the solutions, which resulted in patents and spin-off applications. Author Ralph Hermansen, with years of experience of hands-on experience, is an expert in formulating epoxies, polyurethanes, and other polymers into compounds that have unique properties, and here he shares his knowledge and experience of attaining novel solutions to very challenging problems. He covers polymeric compounds such as coatings, adhesives, encapsulants, transparent plastics, and others. Chapters describe the design problem and define which key properties are sought in the new material. The author shares his thinking about how to approach the formulating problem and describes the experimental procedures used to eventually solve the problem. Patent information is shared as well. Once a new family of polymeric compounds is developed, that technology can be used to attack new unsolved materials problems, or spin-offs, and real-life examples are provided to help readers see new applications of the technologies described in the earlier chapters. The book will be of interest to a diverse group of people. Industry professionals already in the business of selling specialty compounds may be able to add new products to their catalogs with little research cost or time by using the information in the book. Formulators, trying to develop a new compound to challenging requirements, may gain insight into how to make a breakthrough. The information in the book will be very valuable to companies needing these novel solutions. And younger people wondering what a career in materials science would be like get a first-hand commentary from someone who has done it.