Li, Er-Ping, <br/><br/>
Electrical modeling and design for 3D system integration :  3D integrated circuits and packaging, signal integrity, power integrity and EMC / 
Er-Ping Li. 
 - 1 PDF (224 pages). 
<br/><br/> Includes index. 
<br/><br/>Includes bibliographical references and index. 
<br/><br/>Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. 
<br/><br/> Restricted to subscribers or individual electronic text purchasers. 
<br/><br/>
<br/><br/><br/>Mode of access: World Wide Web 
<br/><br/><label>ISBN: </label>9781118166727 
<br/><br/><label>Standard No.: </label>9786613650047 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Three-dimensional integrated circuits.
<br/><br/><label>Index Terms--Genre/Form: </label><br/>Electronic books.
<br/><br/><label>LC Class. No.: </label>TK7874.893  / .E7 2012eb 
<br/><br/><label>Dewey Class. No.: </label>621.3815