Saha, Sujoy Kumar. <br/><br/>
Heat Transfer Enhancement in Plate and Fin Extended Surfaces  [electronic resource] / 
by Sujoy Kumar Saha, Hrishiraj Ranjan, Madhu Sruthi Emani, Anand Kumar Bharti. 
 - 1st ed. 2020. 
 - XI, 145 p. 119 illus., 31 illus. in color.  online resource. 
 - SpringerBriefs in Thermal Engineering and Applied Science,  2193-2549 .
 - SpringerBriefs in Thermal Engineering and Applied Science, .
<br/><br/>Chapter 1. Introduction -- Chapter 2. Offset-Strip Fins -- Chapter 3. Louver Fins and Convex Louver Fins -- Chapter 4. Vortex Generators -- Chapter 5. Wavy Fin, 3D-Corrugated Fin, Perforated Fin, Pin Fin, Wire Mesh, Metal Foam Fin, Packings, Numerical Simulation -- Chapter 6. Conclusions. 
<br/><br/> This Brief deals with heat transfer and friction in plate and fin extended heat transfer enhancement surfaces. It examines Offset-Strip Fin (OSF), Enhancement Principle, Analytically Based Models for j and f vs. Re, Transition from Laminar to Turbulent Region, Correlations for j and f vs. Re, Use of OSF with Liquids, Effect of Percent Fin Offset, Effect of Burred Edges, Louver fin, heat transfer and friction correlations, flow structure in the louver fin array, analytical model for heat transfer and friction, convex louver fin, wavy fin, 3D corrugated fin, perforated fin, pin fins and wire mesh, types of vortex generators, metal foam fin, plain fin, packings, numerical simulation of various types of fins. 
<br/><br/><label>ISBN: </label>9783030207366 
<br/><br/><label>Standard No.: </label>10.1007/978-3-030-20736-6  doi 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Thermodynamics.<br/>Heat engineering.<br/>Heat transfer.<br/>Mass transfer.<br/>Mechanics, Applied.<br/>Solids.<br/>Engineering Thermodynamics, Heat and Mass Transfer.<br/>Solid Mechanics.<br/>Thermodynamics.
<br/><br/><label>LC Class. No.: </label>TJ265 TP156.M3 
<br/><br/><label>Dewey Class. No.: </label>621.4021