Lau, John H. <br/><br/>
Assembly and Reliability of Lead-Free Solder Joints  [electronic resource] / 
by John H. Lau, Ning-Cheng Lee. 
 - 1st ed. 2020. 
 - XXI, 527 p. 598 illus., 347 illus. in color.  online resource. 
<br/><br/>Solder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints. 
<br/><br/> This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products. 
<br/><br/><label>ISBN: </label>9789811539206 
<br/><br/><label>Standard No.: </label>10.1007/978-981-15-3920-6  doi 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronics.<br/>Electronic circuits.<br/>Electronics and Microelectronics, Instrumentation.<br/>Electronic Circuits and Systems.
<br/><br/><label>LC Class. No.: </label>TK7800-8360 
<br/><br/><label>Dewey Class. No.: </label>621.381