Design of 3D integrated circuits and systems / edited by Rohit Sharma, Indian Institute of Technology Ropar, Punjab, India; Krzysztof Iniewski, managing editor, CMOS Emerging Technologies Research Incorporated, Vancouver, British Columbia, Canada ; foreword by Sung Kyu Lim.
Contributor(s): Sharma, Rohit [editor.]
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BookSeries: Devices, circuits, and systems: Publisher: Boca Raton : CRC Press, [2015]Copyright date: ©2015Description: 1 online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9781466589421; 9781315215709; 9781351822909.Subject(s): Three-dimensional integrated circuitsAdditional physical formats: Print version: : No titleDDC classification: 621.3815 Online resources: Click here to view. 1. 3D integration technology with TSV and IMC bonding / Katsuyuki Sakuma -- 2. Wafer-level three-dimensional ICs for advanced CMOS integration / Ronald J. Gutmann and Jian-Qiang Lu -- 3. Integration of graphics processing cores with microprocessors / Deepak C. Sekar and Chinnakrishnan Ballapuram -- 4. Electrothermal simulation of three-dimensional integrated circuits / Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis -- 5. Thermal management in 3D ICs/systems / Francesco Zanini -- 6. Emerging interconnect technologies for 3D networks-on-chip / Rohit Sharma and Kiyoung Choi -- 7. Inductive-coupling thruchip interface for 3D integration / Noriyuki Miura and Tadahiro Kuroda -- 8. Fabrication and modeling of copper and carbon nanotube-based through-silicon via / Brajesh Kumar Kaushik, Manoj Kumar Majumder, and Archana Kumari -- 9. Low-power testing for 2D/3D devices and systems / Xijiang Lin, Xiaoqing Wen, and Dong Xiang.
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