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Assembly and Reliability of Lead-Free Solder Joints [electronic resource] / by John H. Lau, Ning-Cheng Lee.

By: Lau, John H [author.].
Contributor(s): Lee, Ning-Cheng [author.] | SpringerLink (Online service).
Material type: materialTypeLabelBookPublisher: Singapore : Springer Nature Singapore : Imprint: Springer, 2020Edition: 1st ed. 2020.Description: XXI, 527 p. 598 illus., 347 illus. in color. online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9789811539206.Subject(s): Electronics | Electronic circuits | Electronics and Microelectronics, Instrumentation | Electronic Circuits and SystemsAdditional physical formats: Printed edition:: No title; Printed edition:: No title; Printed edition:: No titleDDC classification: 621.381 Online resources: Click here to access online
Contents:
Solder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints.
In: Springer Nature eBookSummary: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
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Solder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints.

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

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