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Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser and Steffen Kröhnert.

by Keser, Beth, 1971- [editor.] | Kroehnert, Steffen, 1970- [editor.].

Material type: book Book; Format: available online remote; Literary form: Not fiction Publisher: Hoboken, NJ, USA : John Wiley & Sons, Inc., 2019Copyright date: ©2019Online access: Wiley Online Library Availability: No items available

Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser and Steffen Kr�ohnert.

by Keser, Beth, 1971- [editor.] | Kroehnert, Steffen, 1970- [editor.] | IEEE Xplore (Online Service) [distributor.] | Wiley [publisher.].

Material type: book Book; Format: available online remote Publisher: Hoboken, New Jersey, USA : John Wiley & Sons, Inc., 2019Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2019]Online access: Abstract with links to resource Availability: No items available