Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8 [electronic resource] : Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics / edited by Marco Rossi, Marco Sasso, Nathanael Connesson, Raman Singh, Adrian DeWald, David Backman, Paul Gloeckner.
Contributor(s): Rossi, Marco [editor.] | Sasso, Marco [editor.] | Connesson, Nathanael [editor.] | Singh, Raman [editor.] | DeWald, Adrian [editor.] | Backman, David [editor.] | Gloeckner, Paul [editor.] | SpringerLink (Online service).
Material type: BookSeries: Conference Proceedings of the Society for Experimental Mechanics Series: Publisher: Cham : Springer International Publishing : Imprint: Springer, 2014Description: IX, 377 p. 326 illus., 207 illus. in color. online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9783319008769.Subject(s): Engineering | Thermodynamics | Heat engineering | Heat transfer | Mass transfer | Continuum mechanics | Mechanical engineering | Engineering | Mechanical Engineering | Engineering Thermodynamics, Heat and Mass Transfer | Continuum Mechanics and Mechanics of MaterialsAdditional physical formats: Printed edition:: No titleDDC classification: 621 Online resources: Click here to access onlineFrom the Contents: Analysis of Thrust Production in Small Synthetic Flapping Wings -- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian CT Reconstruction. Part I: Discretization and Algorithm -- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian CT Reconstruction. Part II: Hardware Design and Demonstration -- Crack Nucleation Threshold Under Fretting Loading by a Thermal Method -- Crack Growth Study of Fibre Metal Laminates Using Thermoelastic Stress Analysis -- Crack Detection in Large Welded Components Under Fatigue Using TSA -- Hybrid Thermoelastic Analysis of an Unsymmetrically-loaded Structure containing an Arbitrarily-shaped Cutout -- Quantitative Themographic Characterization of Composites -- Thermal Deformation of Micro-structure Diffuser Plate in LED Backlight Unit -- Polariscopy Measurement of Residual Stress in Thin Silicon Wafers.
This critical collection presents early findings and case studies on a wide range of areas, as presented in the Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics. The collection includes papers in the following general technical research areas: • Advances in Residual Stress Measurement Methods • Residual Stress Effects on Material Performance • Optical, Ultrasonic, and Diffraction Methods for Residual Stress Measurement • Thermomechanics & Infrared Imaging • Inverse Methods • Inverse Methods in Plasticity • Applications in Experimental Mechanics Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics is the eighth volume of eight from the Conference.
There are no comments for this item.