000 | 02824nam a22004935i 4500 | ||
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001 | 978-3-642-25376-8 | ||
003 | DE-He213 | ||
005 | 20200421112039.0 | ||
007 | cr nn 008mamaa | ||
008 | 150411s2015 gw | s |||| 0|eng d | ||
020 |
_a9783642253768 _9978-3-642-25376-8 |
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024 | 7 |
_a10.1007/978-3-642-25376-8 _2doi |
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050 | 4 | _aTK7876-7876.42 | |
072 | 7 |
_aTJFN _2bicssc |
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072 | 7 |
_aTEC024000 _2bisacsh |
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072 | 7 |
_aTEC030000 _2bisacsh |
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082 | 0 | 4 |
_a621.3 _223 |
100 | 1 |
_aFischer-Hirchert, Ulrich H. P. _eauthor. |
|
245 | 1 | 0 |
_aPhotonic Packaging Sourcebook _h[electronic resource] : _bFiber-Chip Coupling for Optical Components, Basic Calculations, Modules / _cby Ulrich H. P. Fischer-Hirchert. |
264 | 1 |
_aBerlin, Heidelberg : _bSpringer Berlin Heidelberg : _bImprint: Springer, _c2015. |
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300 |
_aXIX, 325 p. 287 illus., 16 illus. in color. _bonline resource. |
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336 |
_atext _btxt _2rdacontent |
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337 |
_acomputer _bc _2rdamedia |
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338 |
_aonline resource _bcr _2rdacarrier |
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347 |
_atext file _bPDF _2rda |
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505 | 0 | _aIntroduction into Photonic Packaging -- Optical waveguides -- Optical Mode Field Adaptation -- Fiber-chip-coupling -- RF Lines -- Soldering, Adhesive Bonding, Bonding -- Optical Coneection Technology -- Active Adjustment Techniques -- Passive Adjustment Techniques -- Optical Motherboard -- Fiber-Optic Modules -- From Chip Design to the Optimum Package -- Reliability Tests -- Abbreviations -- Index. | |
520 | _aThis book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects. | ||
650 | 0 | _aEngineering. | |
650 | 0 | _aNanotechnology. | |
650 | 0 | _aMicrowaves. | |
650 | 0 | _aOptical engineering. | |
650 | 0 | _aElectronic circuits. | |
650 | 1 | 4 | _aEngineering. |
650 | 2 | 4 | _aMicrowaves, RF and Optical Engineering. |
650 | 2 | 4 | _aNanotechnology and Microengineering. |
650 | 2 | 4 | _aCircuits and Systems. |
710 | 2 | _aSpringerLink (Online service) | |
773 | 0 | _tSpringer eBooks | |
776 | 0 | 8 |
_iPrinted edition: _z9783642253751 |
856 | 4 | 0 | _uhttp://dx.doi.org/10.1007/978-3-642-25376-8 |
912 | _aZDB-2-ENG | ||
942 | _cEBK | ||
999 |
_c56509 _d56509 |