000 03208nam a22005295i 4500
001 978-3-319-29395-0
003 DE-He213
005 20200421112041.0
007 cr nn 008mamaa
008 160426s2016 gw | s |||| 0|eng d
020 _a9783319293950
_9978-3-319-29395-0
024 7 _a10.1007/978-3-319-29395-0
_2doi
050 4 _aTK7888.4
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
082 0 4 _a621.3815
_223
100 1 _aVaisband, Inna P.
_eauthor.
245 1 0 _aOn-Chip Power Delivery and Management
_h[electronic resource] /
_cby Inna P. Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Sel�cuk K�ose, Eby G. Friedman.
250 _a4th ed. 2016.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2016.
300 _aXXXVII, 742 p. 426 illus., 89 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aFrom the Contents: Introduction -- Inductive Properties of Electric Circuits -- Properties of On-Chip Inductive Current Loops -- Electromigration -- Scaling Trends of On-Chip Power Distribution Noise -- High Performance Power Distribution Systems -- On-Chip Power Distribution Networks -- Computer-Aided Design and Analysis -- Closed Form Expressions for Fast IR Drop Analysis.
520 _aThis book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
650 0 _aEngineering.
650 0 _aElectronics.
650 0 _aMicroelectronics.
650 0 _aElectronic circuits.
650 1 4 _aEngineering.
650 2 4 _aCircuits and Systems.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
700 1 _aJakushokas, Renatas.
_eauthor.
700 1 _aPopovich, Mikhail.
_eauthor.
700 1 _aMezhiba, Andrey V.
_eauthor.
700 1 _aK�ose, Sel�cuk.
_eauthor.
700 1 _aFriedman, Eby G.
_eauthor.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9783319293936
856 4 0 _uhttp://dx.doi.org/10.1007/978-3-319-29395-0
912 _aZDB-2-ENG
942 _cEBK
999 _c56650
_d56650