000			03398nam a22006375i 4500
001			978-3-319-09647-6
003			DE-He213
005			20200421112236.0
007			cr nn 008mamaa
008			141015s2015 gw | s |||| 0|eng d
020			_a9783319096476 _9978-3-319-09647-6
024	7		_a10.1007/978-3-319-09647-6 _2doi
050		4	_aTJ265
050		4	_aQC319.8-338.5
072		7	_aTGMB _2bicssc
072		7	_aSCI065000 _2bisacsh
082	0	4	_a621.4021 _223
100	1		_aFan, Yan. _eauthor.
245	1	0	_aThermal Transport in Oblique Finned Micro/Minichannels _h[electronic resource] / _cby Yan Fan, Poh Seng Lee, Pawan Kumar Singh, Yong Jiun Lee.
264		1	_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2015.
300			_aXIII, 130 p. 95 illus., 80 illus. in color. _bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
490	1		_aSpringerBriefs in Applied Sciences and Technology, _x2191-530X
505	0		_aIntroduction -- Planar Oblique Fin Microchannel Heat Sink -- Cylindrical Oblique Fin Minichannel Heat Sink -- Thermal Management and Application for Oblique Fins -- Conclusions -- Appendix -- References.
520			_aThe main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques  Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies. Evaluate the feasibility of employing the proposed solution in cooling non-uniform heat fluxes and hotspot suppression Conduct the similarity analysis and parametric study to obtain empirical correlations to evaluate the total heat transfer rate of the oblique fin heat sink Investigate the flow mechanism and optimize the dimensions of cylindrical oblique fin heat sink Investigate the influence of edge effect on flow and temperature uniformity in these oblique fin channels.
650		0	_aEngineering.
650		0	_aEnergy systems.
650		0	_aThermodynamics.
650		0	_aHeat engineering.
650		0	_aHeat transfer.
650		0	_aMass transfer.
650		0	_aFluid mechanics.
650		0	_aMachinery.
650		0	_aElectronics.
650		0	_aMicroelectronics.
650	1	4	_aEngineering.
650	2	4	_aEngineering Thermodynamics, Heat and Mass Transfer.
650	2	4	_aEngineering Fluid Dynamics.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aEnergy Systems.
650	2	4	_aMachinery and Machine Elements.
700	1		_aLee, Poh Seng. _eauthor.
700	1		_aSingh, Pawan Kumar. _eauthor.
700	1		_aLee, Yong Jiun. _eauthor.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9783319096469
830		0	_aSpringerBriefs in Applied Sciences and Technology, _x2191-530X
856	4	0	_uhttp://dx.doi.org/10.1007/978-3-319-09647-6
912			_aZDB-2-ENG
942			_cEBK
999			_c58262 _d58262