000 03299nam a22005295i 4500
001 978-3-319-07611-9
003 DE-He213
005 20200421112547.0
007 cr nn 008mamaa
008 140821s2015 gw | s |||| 0|eng d
020 _a9783319076119
_9978-3-319-07611-9
024 7 _a10.1007/978-3-319-07611-9
_2doi
050 4 _aTK7888.4
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
082 0 4 _a621.3815
_223
100 1 _aSalah, Khaled.
_eauthor.
245 1 0 _aArbitrary Modeling of TSVs for 3D Integrated Circuits
_h[electronic resource] /
_cby Khaled Salah, Yehea Ismail, Alaa El-Rouby.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2015.
300 _aIX, 179 p. 159 illus., 99 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aAnalog Circuits and Signal Processing,
_x1872-082X
505 0 _aIntroduction: Work around Moore's Law -- 3D/TSV Enabling Technologies -- TSV Modeling and Analysis -- TSV Verification -- TSV Macro-Modeling Framework -- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter -- Imperfection in TSV Modeling -- New Trends in TSV -- TSV Fabrication -- Conclusions.
520 _aThis book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects.  Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis, and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor,  and inductive-based communication system, and bandpass filtering. �Introduces a robust model that captures accurately all the loss modes of a TSV,  coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region; �Enables readers to use a model which is technology dependent and can be used for any TSV configuration; �Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors; �Equips readers for fast parasitic extraction of TSVs for 3D IC design.
650 0 _aEngineering.
650 0 _aMicroprocessors.
650 0 _aElectronics.
650 0 _aMicroelectronics.
650 0 _aElectronic circuits.
650 1 4 _aEngineering.
650 2 4 _aCircuits and Systems.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aProcessor Architectures.
700 1 _aIsmail, Yehea.
_eauthor.
700 1 _aEl-Rouby, Alaa.
_eauthor.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9783319076102
830 0 _aAnalog Circuits and Signal Processing,
_x1872-082X
856 4 0 _uhttp://dx.doi.org/10.1007/978-3-319-07611-9
912 _aZDB-2-ENG
942 _cEBK
999 _c58608
_d58608