| 000 | 03094nam a2200829 i 4500 | ||
|---|---|---|---|
| 001 | 6183551 | ||
| 003 | IEEE | ||
| 005 | 20200421114417.0 | ||
| 006 | m o d | ||
| 007 | cr |n||||||||| | ||
| 008 | 151221s2012 nju ob 001 eng d | ||
| 020 |
_a9781118166727 _qebook |
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| 020 |
_z1118166728 _qelectronic |
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| 020 |
_z0470623462 _qhardback |
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| 020 |
_z9780470623466 _qprint |
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| 024 | 8 | _a9786613650047 | |
| 035 | _a(CaBNVSL)mat06183551 | ||
| 035 | _a(IDAMS)0b000064817eb439 | ||
| 040 |
_aCaBNVSL _beng _erda _cCaBNVSL _dCaBNVSL |
||
| 050 | 4 |
_aTK7874.893 _b.E7 2012eb |
|
| 082 | 0 | 4 |
_a621.3815 _223 |
| 100 | 1 |
_aLi, Er-Ping, _eauthor. |
|
| 245 | 1 | 0 |
_aElectrical modeling and design for 3D system integration : _b3D integrated circuits and packaging, signal integrity, power integrity and EMC / _cEr-Ping Li. |
| 264 | 1 |
_a[United States] : _bIEEE Press ; _aHoboken [New Jersey] : _bWiley, |
|
| 264 | 2 |
_a[Piscataqay, New Jersey] : _bIEEE Xplore, _c[2012] |
|
| 300 | _a1 PDF (224 pages). | ||
| 336 |
_atext _2rdacontent |
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| 337 |
_aelectronic _2isbdmedia |
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| 338 |
_aonline resource _2rdacarrier |
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| 500 | _aIncludes index. | ||
| 504 | _aIncludes bibliographical references and index. | ||
| 505 | 0 | _aMacromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. | |
| 506 | 1 | _aRestricted to subscribers or individual electronic text purchasers. | |
| 530 | _aAlso available in print. | ||
| 538 | _aMode of access: World Wide Web | ||
| 588 | _aDescription based on PDF viewed 12/21/2015. | ||
| 650 | 0 | _aThree-dimensional integrated circuits. | |
| 655 | 0 | _aElectronic books. | |
| 695 | _aAdmittance | ||
| 695 | _aCopper | ||
| 695 | _aElectromagnetic compatibility | ||
| 695 | _aElectromagnetics | ||
| 695 | _aEquations | ||
| 695 | _aEquivalent circuits | ||
| 695 | _aEtching | ||
| 695 | _aFabrication | ||
| 695 | _aFrequency domain analysis | ||
| 695 | _aFunction approximation | ||
| 695 | _aImpedance | ||
| 695 | _aIndexes | ||
| 695 | _aIntegral equations | ||
| 695 | _aIntegrated circuit interconnections | ||
| 695 | _aIntegrated circuit modeling | ||
| 695 | _aMathematical model | ||
| 695 | _aMicrowave circuits | ||
| 695 | _aPackaging | ||
| 695 | _aPower transmission lines | ||
| 695 | _aPrinted circuits | ||
| 695 | _aScattering | ||
| 695 | _aSilicon | ||
| 695 | _aSimulation | ||
| 695 | _aSolid modeling | ||
| 695 | _aSystem-on-a-chip | ||
| 695 | _aThree dimensional displays | ||
| 695 | _aThrough-silicon vias | ||
| 695 | _aTransmission line matrix methods | ||
| 710 | 2 |
_aIEEE Xplore (Online Service), _edistributor. |
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| 710 | 2 |
_aWiley InterScience (Online service), _epublisher. |
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| 776 | 0 | 8 |
_iPrint version: _z9780470623466 |
| 856 | 4 | 2 |
_3Abstract with links to resource _uhttp://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551 |
| 942 | _cEBK | ||
| 999 |
_c59822 _d59822 |
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