000 06223cam a2200601Ii 4500
001 on1090728146
003 OCoLC
005 20220711203510.0
006 m o d
007 cr cnu|||unuuu
008 190327s2019 gw ob 001 0 eng d
040 _aN$T
_beng
_erda
_epn
_cN$T
_dN$T
_dDG1
_dYDX
_dUKAHL
_dOCLCF
_dOCLCQ
019 _a1091134717
020 _a9783527813995
_q(electronic bk.)
020 _a3527813993
_q(electronic bk.)
020 _a9783527813964
_q(electronic bk. ;
_qoBook)
020 _a3527813969
_q(electronic bk. ;
_qoBook)
020 _z9783527344192
020 _z3527344195
029 1 _aAU@
_b000065306728
029 1 _aCHNEW
_b001050883
029 1 _aCHVBK
_b567422364
035 _a(OCoLC)1090728146
_z(OCoLC)1091134717
050 4 _aTK7871
072 7 _aTEC
_x009070
_2bisacsh
082 0 4 _a621.381
_223
049 _aMAIN
245 0 0 _aHarsh environment electronics :
_binterconnect materials and performance assessment /
_cedited by Ahmed Sharif.
264 1 _aWeinheim, Germany :
_bWiley-VCH Verlag GmbH & Co.,
_c[2019]
264 4 _c©2019
300 _a1 online resource
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
504 _aIncludes bibliographical references and index.
520 _aProvides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact.-Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
505 0 _aWide-Bandgap Semiconductor Device Technologies for High-Temperature and Harsh Environment Applications / Md Rafiqul Islam, Roisul H Galib, Montajar Sarkar, Shaestagir Chowdhury -- High-Temperature Lead-free Solder Materials and Applications / Mohd F M Sabri, Bakhtiar Ali, Suhana M Said -- Role of Alloying Addition in Zn-Based Pb-Free Solders / Khairul Islam, Ahmed Sharif -- Effect of Cooling Rate on the Microstructure, Mechanical Properties, and Creep Resistance of a Cast Zn-Al-Mg High-temperature Lead-Free Solder Alloy / Reza Mahmudi, Davood Farasheh, Seyyed S Biriaie -- Development of Zn-Al-x Ni Lead-Free Solders for High-Temperature Applications / Sanjoy Mallick, Md Sharear Kabir, Ahmed Sharif -- Study of Zn-Mg-Ag High-Temperature Solder Alloys / Roisul H Galib, Md Ashif Anwar, Ahmed Sharif -- Characterization of Zn-Mo and Zn-Cr Pb-Free Composite Solders as a Potential Replacement for Pb-Containing Solders / Khairul Islam, Ahmed Sharif -- Gold-Based Interconnect Systems for High-Temperature and Harsh Environments / Ayesha Akter, Ahmed Sharif, Rubayyat Mahbub -- Bi-Based Interconnect Systems and Applications / Manifa Noor, Ahmed Sharif -- Recent Advancement of Research in Silver-Based Solder Alloys / Ahmed Sharif -- Silver Nanoparticles as Interconnect Materials / Md Ashif Anwar, Roisul Hasan Galib, Ahmed Sharif -- Transient Liquid Phase Bonding / Tariq Islam, Ahmed Sharif -- All-Copper Interconnects for High-Temperature Applications / Ahmed Sharif -- Glass-Frit-Based Die-Attach Solution for Harsh Environments / Ahmed Sharif -- Carbon-Nanotube-Reinforced Solders as Thermal Interface Materials / Md Muktadir Billah -- Reliability Study of Solder Joints in Electronic Packaging Technology / Ahmed Sharif, Sushmita Majumder.
588 0 _aOnline resource; title from PDF title page (EBSCO, viewed March 28, 2019).
650 0 _aElectronics
_xMaterials
_xEffect of temperature on.
_98254
650 0 _aExtreme environments.
_96946
650 0 _aMaterials at high temperatures.
_94260
650 0 _aHeat resistant materials.
_98255
650 7 _aTECHNOLOGY & ENGINEERING
_xMechanical.
_2bisacsh
_98256
650 7 _aExtreme environments.
_2fast
_0(OCoLC)fst00919061
_96946
650 7 _aHeat resistant materials.
_2fast
_0(OCoLC)fst00953968
_98255
650 7 _aMaterials at high temperatures.
_2fast
_0(OCoLC)fst01011904
_94260
655 4 _aElectronic books.
_93294
700 1 _aSharif, Ahmed,
_eeditor.
_98257
776 0 8 _iPrint version:
_tHarsh environment electronics.
_dWeinheim, Germany : Wiley-VCH Verlag GmbH & Co., [2019]
_z3527344195
_z9783527344192
_w(OCoLC)1031452121
856 4 0 _uhttps://doi.org/10.1002/9783527813964
_zWiley Online Library
942 _cEBK
994 _a92
_bDG1
999 _c69053
_d69053