| 000 | 01835cam a2200361Ii 4500 | ||
|---|---|---|---|
| 001 | 9781315368825 | ||
| 008 | 180706t20172017flua ob 001 0 eng d | ||
| 020 |
_a9781315368825 _q(e-book : PDF) |
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| 020 |
_a9781315332758 _q(e-book: Mobi) |
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| 020 |
_z9781498745529 _q(hardback) |
||
| 024 | 7 |
_a10.1201/9781315368825 _2doi |
|
| 035 | _a(OCoLC)964699022 | ||
| 040 |
_aFlBoTFG _cFlBoTFG _erda |
||
| 050 | 4 |
_aTK7874.53 _b.K38 2017 |
|
| 082 | 0 | 4 |
_a621.395 _bK217 |
| 100 | 1 |
_aKaushik, Brajesh Kumar, _eauthor. _914246 |
|
| 245 | 1 | 0 |
_aThrough silicon vias : _bmaterials, models, design, and performance / _cBrajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam. |
| 264 | 1 |
_aBoca Raton : _bCRC Press, _c[2017] |
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| 264 | 4 | _c©2017 | |
| 300 | _a1 online resource | ||
| 336 |
_atext _2rdacontent |
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| 337 |
_acomputer _2rdamedia |
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| 338 |
_aonline resource _2rdacarrier |
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| 505 | 0 | _a1. Three-dimensional technology and packaging techniques -- 2. Through silicon vias : materials, properties, and fabrication -- 3. Copper-based through silicon vias -- 4. Modeling and performance analysis of CNT-based through silicon vias -- 5. Mixed CNT bundled through silicon vias -- 6. Graphene nanoribbon-based through silicon vias -- 7. Liners in through silicon vias -- 8. Modeling of through silicon vias using finite-difference time-domain technique. | |
| 650 | 0 |
_aThree-dimensional integrated circuits. _913960 |
|
| 650 | 0 |
_aInterconnects (Integrated circuit technology) _96371 |
|
| 700 | 1 |
_aAlam, Arsalan, _eauthor. _914247 |
|
| 700 | 1 |
_aKumar, Vobulapuram Ramesh, _eauthor. _914248 |
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| 700 | 1 |
_aMajumder, Manoj Kumar, _eauthor. _914249 |
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| 776 | 0 | 8 |
_iPrint version: _z9781498745529 _w(DLC) 2016009688 |
| 856 | 4 | 0 |
_uhttps://www.taylorfrancis.com/books/9781315368825 _zClick here to view. |
| 942 | _cEBK | ||
| 999 |
_c70657 _d70657 |
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