000			03405nam a2200589 i 4500
001			9063370
003			IEEE
005			20220712210026.0
006			m o d
007			cr |n|||||||||
008			200429s2020 nju ob 001 eng d
010			_z 2019057783 (print)
019			_a1143846527
020			_a1119556651
020			_a9781119556640 _qadobe pdf
020			_z9781119556657 _qePub
020			_a1119556643
020			_z9781119556633 _qcloth
020			_z9781119556671 _qelectronic bk.
020			_z1119556678 _qelectronic bk.
020			_z1119556635
024	7		_a10.1002/9781119556671 _2doi
035			_a(CaBNVSL)mat09063370
035			_a(IDAMS)0b0000648c8c354a
040			_aCaBNVSL _beng _erda _cCaBNVSL _dCaBNVSL
050	0	0	_aTK7871.67.M5
082	0	0	_a621.382/4 _223
245	0	0	_aAntenna-in-package technology and applications / _cedited by Duixian Liu, Yueping Zhang.
250			_aFirst edition.
264		1	_aHoboken, New Jersey : _bWiley-IEEE Press, _c[2020]
264		2	_a[Piscataqay, New Jersey] : _bIEEE Xplore, _c[2020]
300			_a1 PDF.
336			_atext _2rdacontent
337			_aelectronic _2isbdmedia
338			_aonline resource _2rdacarrier
504			_aIncludes bibliographical references and index.
505	0		_aAntennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida.
506			_aRestricted to subscribers or individual electronic text purchasers.
520			_a"This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"-- _cProvided by publisher.
530			_aAlso available in print.
538			_aMode of access: World Wide Web
650		0	_aMicrostrip antennas. _94866
650		0	_aMicroelectronic packaging. _94867
655		4	_aElectronic books. _93294
700	1		_aLiu, Duixian, _eeditor. _929638
700	1		_aZhang, Yueping, _eeditor. _929639
710	2		_aIEEE Xplore (Online Service), _edistributor. _929640
710	2		_aWiley, _epublisher. _929641
776	0	8	_iPrint version: _tAntenna-in-package technology and applications _bFirst edition. _dHoboken, New Jersey : Wiley-IEEE Press, [2020] _z9781119556633 _w(DLC) 2019057782
856	4	2	_3Abstract with links to resource _uhttps://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=9063370
942			_cEBK
999			_c74641 _d74641