000 03886nam a22004815i 4500
001 978-3-319-93683-3
003 DE-He213
005 20220801213539.0
007 cr nn 008mamaa
008 181220s2019 sz | s |||| 0|eng d
020 _a9783319936833
_9978-3-319-93683-3
024 7 _a10.1007/978-3-319-93683-3
_2doi
050 4 _aTK7867-7867.5
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
072 7 _aTJFC
_2thema
082 0 4 _a621.3815
_223
100 1 _aMcPherson, J. W.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_932778
245 1 0 _aReliability Physics and Engineering
_h[electronic resource] :
_bTime-To-Failure Modeling /
_cby J. W. McPherson.
250 _a3rd ed. 2019.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2019.
300 _aXVII, 463 p. 207 illus., 164 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aIntroduction -- Physics of Degradation -- Time Dependence of Materials and Device Degradation -- From Material/Device Degradation to Time-To-Failure -- Time-To-Failure Modeling -- Gaussian Statistics - An Overview -- Time-To-Failure Statistics -- Failure Rate Modeling -- Accelerated Degradation -- Acceleration Factor Modeling -- Ramp-To-Failure Testing -- Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits -- Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering -- Conversion of Dynamical Stresses Into Effective Static Values -- Resonance and Resonance-Induced Degradation -- Increasing the Reliability of Device/Product Designs -- Screening -- Heat Generation and Dissipation -- Sampling Plans and Confidence Intervals -- .
520 _aThis third edition textbook provides the basics of reliability physics and engineering that are needed by electrical engineers, mechanical engineers, civil engineers, biomedical engineers, materials scientists, and applied physicists to help them to build better devices/products. The information contained within should help all fields of engineering to develop better methodologies for: more reliable product designs, more reliable materials selections, and more reliable manufacturing processes— all of which should help to improve product reliability. A mathematics level through differential equations is needed. Also, a familiarity with the use of excel spreadsheets is assumed. Any needed statistical training and tools are contained within the text. While device failure is a statistical process (thus making statistics important), the emphasis of this book is clearly on the physics of failure and developing the reliability engineering tools required for product improvements during device-design and device-fabrication phases. Provides a comprehensive textbook on reliability physics of semiconductors, from fundamentals to applications; Explains the fundamentals of reliability physics and engineering tools for building better products; Contains statistical training and tools within the text; Includes new chapters on Physics of Degradation, and Resonance and Resonance-Induced Degradation.
650 0 _aElectronic circuits.
_919581
650 0 _aSecurity systems.
_931879
650 1 4 _aElectronic Circuits and Systems.
_932779
650 2 4 _aSecurity Science and Technology.
_931884
710 2 _aSpringerLink (Online service)
_932780
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9783319936826
776 0 8 _iPrinted edition:
_z9783319936840
856 4 0 _uhttps://doi.org/10.1007/978-3-319-93683-3
912 _aZDB-2-ENG
912 _aZDB-2-SXE
942 _cEBK
999 _c75310
_d75310