000 03987nam a22005535i 4500
001 978-3-319-69395-8
003 DE-He213
005 20220801213944.0
007 cr nn 008mamaa
008 180725s2019 sz | s |||| 0|eng d
020 _a9783319693958
_9978-3-319-69395-8
024 7 _a10.1007/978-3-319-69395-8
_2doi
050 4 _aTA174
072 7 _aTBD
_2bicssc
072 7 _aTEC016020
_2bisacsh
072 7 _aTBD
_2thema
082 0 4 _a620.0042
_223
100 1 _aSerksnis, Tony.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_935441
245 1 0 _aDesigning Electronic Product Enclosures
_h[electronic resource] /
_cby Tony Serksnis.
250 _a1st ed. 2019.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2019.
300 _aXXI, 211 p. 56 illus., 25 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aIntroduction and Author’s Credentials -- Outline of Text -- Successful Design -- Building the Design -- Structural Considerations.
520 _aThis text explains the process of the design of product electronic enclosures. These products typically contain a printed circuit board. The text takes the reader from the original idea for a product, through the shipment in quantity to a customer. For the product enclosure designer, this proceeds through design layout, material selection, prototype building, testing, and ongoing design improvement. The book presents a substantive and lucid treatment of the structural, thermal, user-interface, assembly, quality control, and cost considerations of the product enclosure. Of special note is a discussion on the regulatory issues involved with the design of a product. A main thrust of the text is on the "commercialization" aspects of electronic products, that is, when an enclosure is needed for the product to meet environmental and certification requirements globally. The book targets the broadest audience tasked to design/manufacture an enclosure, from mechanical/industrial engineers to designers and technicians. While the intent of the text is not to provide a complete understanding of relevant physical phenomena addressed (strength of materials, shock and vibration, heat transfer), the book provides a ready reference on how and where these key properties may be considered in the design of most electronic enclosures. Elucidates successful enclosure design for electronic products, defining the design team and the definition of success Explains the processes for building enclosures, including printed circuit board layout (mechanical considerations) and optimal object placement, structural considerations, material selection, and user interface design Includes treatment of serviceability, product environments, standards and testing, cooling techniques as well as guidelines for Electromagnetic Compliance (EMC) standards and testing required to pass FCC/CE Reinforces design concepts presented with relevant solved problems.
650 0 _aEngineering design.
_93802
650 0 _aManufactures.
_931642
650 0 _aThermodynamics.
_93554
650 0 _aHeat engineering.
_95144
650 0 _aHeat transfer.
_932329
650 0 _aMass transfer.
_94272
650 1 4 _aEngineering Design.
_93802
650 2 4 _aMachines, Tools, Processes.
_931645
650 2 4 _aEngineering Thermodynamics, Heat and Mass Transfer.
_932330
710 2 _aSpringerLink (Online service)
_935442
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9783319693941
776 0 8 _iPrinted edition:
_z9783319693965
776 0 8 _iPrinted edition:
_z9783030098872
856 4 0 _uhttps://doi.org/10.1007/978-3-319-69395-8
912 _aZDB-2-ENG
912 _aZDB-2-SXE
942 _cEBK
999 _c75790
_d75790