000 04107nam a22005655i 4500
001 978-3-030-25201-4
003 DE-He213
005 20220801214001.0
007 cr nn 008mamaa
008 190903s2020 sz | s |||| 0|eng d
020 _a9783030252014
_9978-3-030-25201-4
024 7 _a10.1007/978-3-030-25201-4
_2doi
050 4 _aTA349-359
072 7 _aTGMD
_2bicssc
072 7 _aSCI096000
_2bisacsh
072 7 _aTGMD
_2thema
082 0 4 _a620.105
_223
100 1 _aChen, Zengtao.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_935612
245 1 0 _aAdvanced Thermal Stress Analysis of Smart Materials and Structures
_h[electronic resource] /
_cby Zengtao Chen, Abdolhamid Akbarzadeh.
250 _a1st ed. 2020.
264 1 _aCham :
_bSpringer International Publishing :
_bImprint: Springer,
_c2020.
300 _aX, 304 p. 104 illus., 44 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aStructural Integrity,
_x2522-5618 ;
_v10
505 0 _aHeat conduction and moisture diffusion theories -- Basic Problems of Non-Fourier Heat Conduction -- Multiphysics of smart materials and structures -- Coupled thermal stresses in advanced and smart materials -- Thermal Fracture of Advanced Materials based on Fourier Heat Conduction -- Advanced thermal fracture analysis based on non-Fourier heat conduction models -- Future Perspectives.
520 _aThis is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials. .
650 0 _aMechanics, Applied.
_93253
650 0 _aSolids.
_93750
650 0 _aMaterials—Analysis.
_935613
650 0 _aMathematical models.
_94632
650 1 4 _aSolid Mechanics.
_931612
650 2 4 _aCharacterization and Analytical Technique.
_935614
650 2 4 _aMathematical Modeling and Industrial Mathematics.
_933097
700 1 _aAkbarzadeh, Abdolhamid.
_eauthor.
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
_935615
710 2 _aSpringerLink (Online service)
_935616
773 0 _tSpringer Nature eBook
776 0 8 _iPrinted edition:
_z9783030252007
776 0 8 _iPrinted edition:
_z9783030252021
776 0 8 _iPrinted edition:
_z9783030252038
830 0 _aStructural Integrity,
_x2522-5618 ;
_v10
_935617
856 4 0 _uhttps://doi.org/10.1007/978-3-030-25201-4
912 _aZDB-2-ENG
912 _aZDB-2-SXE
942 _cEBK
999 _c75826
_d75826