| 000 | 03092nam a22005055i 4500 | ||
|---|---|---|---|
| 001 | 978-981-15-3920-6 | ||
| 003 | DE-He213 | ||
| 005 | 20220801215555.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 200529s2020 si | s |||| 0|eng d | ||
| 020 |
_a9789811539206 _9978-981-15-3920-6 |
||
| 024 | 7 |
_a10.1007/978-981-15-3920-6 _2doi |
|
| 050 | 4 | _aTK7800-8360 | |
| 072 | 7 |
_aTJF _2bicssc |
|
| 072 | 7 |
_aTEC008000 _2bisacsh |
|
| 072 | 7 |
_aTJF _2thema |
|
| 082 | 0 | 4 |
_a621.381 _223 |
| 100 | 1 |
_aLau, John H. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _945188 |
|
| 245 | 1 | 0 |
_aAssembly and Reliability of Lead-Free Solder Joints _h[electronic resource] / _cby John H. Lau, Ning-Cheng Lee. |
| 250 | _a1st ed. 2020. | ||
| 264 | 1 |
_aSingapore : _bSpringer Nature Singapore : _bImprint: Springer, _c2020. |
|
| 300 |
_aXXI, 527 p. 598 illus., 347 illus. in color. _bonline resource. |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_acomputer _bc _2rdamedia |
||
| 338 |
_aonline resource _bcr _2rdacarrier |
||
| 347 |
_atext file _bPDF _2rda |
||
| 505 | 0 | _aSolder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints. | |
| 520 | _aThis book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products. | ||
| 650 | 0 |
_aElectronics. _93425 |
|
| 650 | 0 |
_aElectronic circuits. _919581 |
|
| 650 | 1 | 4 |
_aElectronics and Microelectronics, Instrumentation. _932249 |
| 650 | 2 | 4 |
_aElectronic Circuits and Systems. _945189 |
| 700 | 1 |
_aLee, Ning-Cheng. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _945190 |
|
| 710 | 2 |
_aSpringerLink (Online service) _945191 |
|
| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9789811539190 |
| 776 | 0 | 8 |
_iPrinted edition: _z9789811539213 |
| 776 | 0 | 8 |
_iPrinted edition: _z9789811539220 |
| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-981-15-3920-6 |
| 912 | _aZDB-2-ENG | ||
| 912 | _aZDB-2-SXE | ||
| 942 | _cEBK | ||
| 999 |
_c77636 _d77636 |
||