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| 001 | 978-3-319-44586-1 | ||
| 003 | DE-He213 | ||
| 005 | 20220801221133.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 170125s2017 sz | s |||| 0|eng d | ||
| 020 |
_a9783319445861 _9978-3-319-44586-1 |
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_a10.1007/978-3-319-44586-1 _2doi |
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_a621.381 _223 |
| 245 | 1 | 0 |
_a3D Microelectronic Packaging _h[electronic resource] : _bFrom Fundamentals to Applications / _cedited by Yan Li, Deepak Goyal. |
| 250 | _a1st ed. 2017. | ||
| 264 | 1 |
_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2017. |
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| 300 |
_aIX, 463 p. 331 illus., 253 illus. in color. _bonline resource. |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 490 | 1 |
_aSpringer Series in Advanced Microelectronics, _x2197-6643 ; _v57 |
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| 505 | 0 | _aIntroduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging. . | |
| 520 | _aThis volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis Discusses 3D electronic package architecture and assembly process design Features contributions from both academic and industry authors, for a complete view of this important technology. | ||
| 650 | 0 |
_aElectronics. _93425 |
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| 650 | 0 |
_aOptical materials. _97729 |
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| 650 | 0 |
_aElectronic circuits. _919581 |
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| 650 | 0 |
_aMicrotechnology. _928219 |
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| 650 | 0 |
_aMicroelectromechanical systems. _96063 |
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| 650 | 0 |
_aMetals. _911824 |
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| 650 | 1 | 4 |
_aElectronics and Microelectronics, Instrumentation. _932249 |
| 650 | 2 | 4 |
_aOptical Materials. _97729 |
| 650 | 2 | 4 |
_aElectronic Circuits and Systems. _954311 |
| 650 | 2 | 4 |
_aMicrosystems and MEMS. _954312 |
| 650 | 2 | 4 |
_aMetals and Alloys. _931871 |
| 700 | 1 |
_aLi, Yan. _eeditor. _4edt _4http://id.loc.gov/vocabulary/relators/edt _954313 |
|
| 700 | 1 |
_aGoyal, Deepak. _eeditor. _4edt _4http://id.loc.gov/vocabulary/relators/edt _954314 |
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| 710 | 2 |
_aSpringerLink (Online service) _954315 |
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| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319445847 |
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_iPrinted edition: _z9783319445854 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319830865 |
| 830 | 0 |
_aSpringer Series in Advanced Microelectronics, _x2197-6643 ; _v57 _954316 |
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| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-3-319-44586-1 |
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