| 000 | 03960nam a22005295i 4500 | ||
|---|---|---|---|
| 001 | 978-3-319-29746-0 | ||
| 003 | DE-He213 | ||
| 005 | 20220801221715.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 160709s2017 sz | s |||| 0|eng d | ||
| 020 |
_a9783319297460 _9978-3-319-29746-0 |
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| 024 | 7 |
_a10.1007/978-3-319-29746-0 _2doi |
|
| 050 | 4 | _aTK7867-7867.5 | |
| 072 | 7 |
_aTJFC _2bicssc |
|
| 072 | 7 |
_aTEC008010 _2bisacsh |
|
| 072 | 7 |
_aTJFC _2thema |
|
| 082 | 0 | 4 |
_a621.3815 _223 |
| 245 | 1 | 0 |
_aCarbon Nanotubes for Interconnects _h[electronic resource] : _bProcess, Design and Applications / _cedited by Aida Todri-Sanial, Jean Dijon, Antonio Maffucci. |
| 250 | _a1st ed. 2017. | ||
| 264 | 1 |
_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2017. |
|
| 300 |
_aXII, 333 p. 167 illus., 133 illus. in color. _bonline resource. |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 505 | 0 | _aInterconnect challenges for 2D and 3D Integration -- Overview of Carbon Nanotube Physical Properties -- Overview of Carbon Nanotube Processing Methods -- Electrical Conductivity of Carbon Nanotubes – Modeling and Characterization -- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material -- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects -- Carbon Nanotubes as Vertical Interconnects for 3D ICs -- Carbon Nanotubes as Micro-Bumps for 3D Integration -- Electrothermal Modeling of Carbon Nanotubes TSVs -- Exploring Carbon Nanotubes for 3D Power Delivery Networks -- Carbon Nanotubes for Monolithic 3D ICs. | |
| 520 | _aThis book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects. | ||
| 650 | 0 |
_aElectronic circuits. _919581 |
|
| 650 | 0 |
_aMicroprocessors. _957521 |
|
| 650 | 0 |
_aComputer architecture. _93513 |
|
| 650 | 1 | 4 |
_aElectronic Circuits and Systems. _957522 |
| 650 | 2 | 4 |
_aProcessor Architectures. _957523 |
| 700 | 1 |
_aTodri-Sanial, Aida. _eeditor. _4edt _4http://id.loc.gov/vocabulary/relators/edt _957524 |
|
| 700 | 1 |
_aDijon, Jean. _eeditor. _4edt _4http://id.loc.gov/vocabulary/relators/edt _957525 |
|
| 700 | 1 |
_aMaffucci, Antonio. _eeditor. _4edt _4http://id.loc.gov/vocabulary/relators/edt _957526 |
|
| 710 | 2 |
_aSpringerLink (Online service) _957527 |
|
| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319297446 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319297453 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319806426 |
| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-3-319-29746-0 |
| 912 | _aZDB-2-ENG | ||
| 912 | _aZDB-2-SXE | ||
| 942 | _cEBK | ||
| 999 |
_c79960 _d79960 |
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