| 000 | 03165nam a22005415i 4500 | ||
|---|---|---|---|
| 001 | 978-3-319-20385-0 | ||
| 003 | DE-He213 | ||
| 005 | 20220801222546.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 151028s2016 sz | s |||| 0|eng d | ||
| 020 |
_a9783319203850 _9978-3-319-20385-0 |
||
| 024 | 7 |
_a10.1007/978-3-319-20385-0 _2doi |
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| 050 | 4 | _aTK7867-7867.5 | |
| 072 | 7 |
_aTJFC _2bicssc |
|
| 072 | 7 |
_aTEC008010 _2bisacsh |
|
| 072 | 7 |
_aTJFC _2thema |
|
| 082 | 0 | 4 |
_a621.3815 _223 |
| 100 | 1 |
_aYu, Bei. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _962122 |
|
| 245 | 1 | 0 |
_aDesign for Manufacturability with Advanced Lithography _h[electronic resource] / _cby Bei Yu, David Z. Pan. |
| 250 | _a1st ed. 2016. | ||
| 264 | 1 |
_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2016. |
|
| 300 |
_aXI, 164 p. 100 illus., 91 illus. in color. _bonline resource. |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 505 | 0 | _aIntroduction -- Layout Decomposition for Triple Patterning -- Layout Decomposition for Other Patterning Techniques -- Standard Cell Compliance and Placement Co-Optimization -- Design for Manufacturability with E-Beam Lithography -- Conclusions and Future Works.-. | |
| 520 | _aThis book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL). The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography. Unlike books that discuss DFM from the product level, or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms. Enables readers to tackle the challenge of layout decompositions for different patterning techniques; Presents a coherent framework, including standard cell compliance and detailed placement, to enable Triple Patterning Lithography (TPL) friendly design; Includes coverage of the design for manufacturability with E-Beam lithography. | ||
| 650 | 0 |
_aElectronic circuits. _919581 |
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| 650 | 0 |
_aMicroprocessors. _962123 |
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| 650 | 0 |
_aComputer architecture. _93513 |
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| 650 | 0 |
_aElectronics. _93425 |
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| 650 | 1 | 4 |
_aElectronic Circuits and Systems. _962124 |
| 650 | 2 | 4 |
_aProcessor Architectures. _962125 |
| 650 | 2 | 4 |
_aElectronics and Microelectronics, Instrumentation. _932249 |
| 700 | 1 |
_aPan, David Z. _eauthor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _962126 |
|
| 710 | 2 |
_aSpringerLink (Online service) _962127 |
|
| 773 | 0 | _tSpringer Nature eBook | |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319203843 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319203867 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319373935 |
| 856 | 4 | 0 | _uhttps://doi.org/10.1007/978-3-319-20385-0 |
| 912 | _aZDB-2-ENG | ||
| 912 | _aZDB-2-SXE | ||
| 942 | _cEBK | ||
| 999 |
_c80902 _d80902 |
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