Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li.
By: Li, Er-Ping [author.]
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Contributor(s): IEEE Xplore (Online Service) [distributor.] | Wiley InterScience (Online service) [publisher.].
Material type: 
BookPublisher: [United States] : Hoboken [New Jersey] : IEEE Press ; Wiley, Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2012]Description: 1 PDF (224 pages).Content type: text Media type: electronic Carrier type: online resourceISBN: 9781118166727.Subject(s): Three-dimensional integrated circuits | Admittance | Copper | Electromagnetic compatibility | Electromagnetics | Equations | Equivalent circuits | Etching | Fabrication | Frequency domain analysis | Function approximation | Impedance | Indexes | Integral equations | Integrated circuit interconnections | Integrated circuit modeling | Mathematical model | Microwave circuits | Packaging | Power transmission lines | Printed circuits | Scattering | Silicon | Simulation | Solid modeling | System-on-a-chip | Three dimensional displays | Through-silicon vias | Transmission line matrix methodsGenre/Form: Electronic books.Additional physical formats: Print version:: No titleDDC classification: 621.3815 Online resources: Abstract with links to resource Also available in print.Includes index.
Includes bibliographical references and index.
Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.
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Also available in print.
Mode of access: World Wide Web
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