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Heat Transfer and Pressure Drop in Flow Boiling in Microchannels [electronic resource] / by Sujoy Kumar Saha, Gian Piero Celata.

By: Saha, Sujoy Kumar [author.].
Contributor(s): Celata, Gian Piero [author.] | SpringerLink (Online service).
Material type: materialTypeLabelBookSeries: SpringerBriefs in Thermal Engineering and Applied Science: Publisher: Cham : Springer International Publishing : Imprint: Springer, 2016Edition: 1st ed. 2016.Description: X, 55 p. 40 illus., 16 illus. in color. online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9783319202853.Subject(s): Thermodynamics | Heat engineering | Heat transfer | Mass transfer | Fluid mechanics | Continuum mechanics | Engineering Thermodynamics, Heat and Mass Transfer | Engineering Fluid Dynamics | Continuum MechanicsAdditional physical formats: Printed edition:: No title; Printed edition:: No titleDDC classification: 621.4021 Online resources: Click here to access online
Contents:
1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research.
In: Springer Nature eBookSummary: This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Micro channels,” by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.
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1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research.

This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Micro channels,” by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.

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