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Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li.

by Li, Er-Ping [author.] | IEEE Xplore (Online Service) [distributor.] | Wiley InterScience (Online service) [publisher.].

Material type: book Book; Format: available online remote Publisher: [United States] : Hoboken [New Jersey] : IEEE Press ; Wiley, Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2012]Online access: Abstract with links to resource Availability: No items available

Handbook of 3D integration. Volume 4, Design, test, and thermal management / edited by Paul D. Franzon, Erik Jan Marinissen, and Mihannad S. Bakir.

by Franzon, Paul D [editor.] | Marinissen, Eric Jan [editor.] | Bakir, Muhannad S [editor.].

Material type: book Book; Format: available online remote; Literary form: Not fiction Publisher: Weinheim, Germany : Wiley-VCH, [2019]Other title: Design, test and thermal management | Handbook of three D integration.Online access: Wiley Online Library Availability: No items available

Design of 3D integrated circuits and systems / edited by Rohit Sharma, Indian Institute of Technology Ropar, Punjab, India; Krzysztof Iniewski, managing editor, CMOS Emerging Technologies Research Incorporated, Vancouver, British Columbia, Canada ; foreword by Sung Kyu Lim.

by Sharma, Rohit [editor.].

Material type: book Book; Literary form: Not fiction Publisher: Boca Raton : CRC Press, [2015]Copyright date: ©2015Online access: Click here to view. Availability: No items available

Through silicon vias : materials, models, design, and performance / Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam.

by Kaushik, Brajesh Kumar [author.] | Alam, Arsalan [author.] | Kumar, Vobulapuram Ramesh [author.] | Majumder, Manoj Kumar [author.].

Material type: book Book; Literary form: Not fiction Publisher: Boca Raton : CRC Press, [2017]Copyright date: ©2017Online access: Click here to view. Availability: No items available

Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li.

by Li, Er-Ping [author.] | IEEE Xplore (Online Service) [distributor.] | Wiley InterScience (Online service) [publisher.].

Material type: book Book; Format: available online remote Publisher: [United States] : Hoboken [New Jersey] : IEEE Press ; Wiley, Distributor: [Piscataqay, New Jersey] : IEEE Xplore, [2012]Online access: Abstract with links to resource Availability: No items available